Smarter Packaging: How AI is Reshaping Assembly and Materials Control https://t.co/KpFD6WnNDt From predictive maintenance to excursion monitoring, AI is redefining yield management in multi-die assembly. #semiconductor #advancedpackaging #AI

🍱 Disco used the analogy of a bento box to explain the importance of panel-level packaging. A very creative and fun way to illustrate a complex semiconductor concept! Photo by #SemiVision #Semicon #AdvancedPackaging #PLP #Disco

New technical papers recently added to Semiconductor Engineering’s library https://t.co/FSoFhjxAs6 #semiconductor #AI #inferencing #hardwaresecurity #advancedpackaging #DigitalTwins #automotivemarketing #GPUs #HBM

Siemens and TSMC expand partnership to accelerate 3D IC and AI-driven semiconductor design with certified advanced EDA tools. #3DIC #AdvancedPackaging #AIchipdesign

🚀 Amkor Korea heading to ISES Korea 2025! Join us Aug 27-28 in Suwon as we explore AI's future through advanced packaging, power semiconductors & HBM innovations. Ready to push AI further? Let's connect! 🤝 #ISES2025 #SemiconductorIndustry #AdvancedPackaging #AmkorTechnology

Dzięki @JG_VALUE_GROWTH za zmotywowanie do przedstawienia case'a spółki Camtek $CAMT, która w mojej ocenie może być 10-baggerem w perspektywie ok 5 lat. $CAMT zajmuje się systemami metrologicznymi, jednak żeby zrozumieć ich potencjał, konieczne jest zrozumienie #advancedpackaging

We have heard a lot about Front-End China localization; that is China producing their own Front-End tools to replace international suppliers like $AMAT $LRCX $KLAC and $TEL But what we should watch going forward is how China builds up their own #AdvancedPackaging ecosystem.

SEMICON India 2025 To Highlight Nation’s Rise As Semiconductor Hub @narendramodi  #SEMICONIndia2025 #IndiaSemiconductorMission #SEMI #MeitY #NarendraModi #CGSemi #Vervesemi #ChipDesign #Semiconductor #OSAT #AdvancedPackaging #indicanews https://t.co/2JwZGqI3IE

Socionext US has announced the availability of 3DIC support in its portfolio for the delivery of complete solutions for consumer, AI, and HPC data centre applications. https://t.co/fhVdZDslms #3DICInnovation #AIandHPC #AdvancedPackaging

This year’s SEMICON West has new dates, a new location in a new city and a new addition to the program—design! Learn more: https://t.co/CnHwgG2nrr #SEMICONWest #Semiconductor #Design #Chiplets #AdvancedPackaging #AI #semieda

Please join us to discuss how Brewer Science’s materials assist with advanced-node patterning and wafer thinning. A Brewer Science representative will be at booth I2310 throughout SEMICON Taiwan. Learn more: https://t.co/Y3ya6MABBB . #AdvancedPackaging

WATCH ▶️: Executive Chair of @innovateuk, Tom Adeyoola spoke to us this week during his visit to our state-of-the-art Innovation Centre to learn more about how our expertise and unique capabilities help UK businesses. #powerelectronics #photonics #RF #advancedpackaging

Issues In Ramping Advanced Packaging How to obtain data at critical points, how to isolate it from other data, and how much data is required to identify real and latent defects. https://t.co/2G3MKIcU1z #semiconductor #advancedpackaging #semiconductortest

To all the Semiconductor #Bravehearts out there, have a perfectly lovely weekend! #AI #HPC #DataCenter #AdvancedPackaging #Semiconductors #HeterogeneousIntegration

Dr. Tom Rucker, VP, Technology Development and Dir-Assembly and Test Technology at Intel, gave an amazing keynote presentation at our event today, reminding us that “packaging is no longer an afterthought; it is an extension of the backend of the fab.” 1/2 #FHE #AdvancedPackaging

At the #SEMICON SEA CEO Summit, our CEO Tim Breen joined leaders from across the industry to address the questions shaping our next chapter. [1/2] #Semiconductors #AdvancedPackaging #Leadership #AI

From #CES Vegas to Silicon island #Taiwan, @nvidia CEO Jensen Huang continues to blaze the #AI trail. This week, #ASE Holdings Siliconware Precision Industries had the incredible opportunity to host Jensen Huang at the launch of their newest #advancedpackaging facility in Tanzi

In the AI era, CoWoS capacity = survival ticket. Whoever secures CoWoS capacity can build AI chips. Those left out… can’t even enter the game. Source : GF Securites #CoWoS #AIChips #NVIDIA #AMD #AdvancedPackaging #Broadcom #AWS #Mediatek

PCBAA and @IPCassociation are urging Congress to restore funding for #AdvancedPackaging and #PCBs in the FY 25 Defense budget for the Defense Production Act. @DeptofDefense budget must match its priorities, which includes securing U.S. supply chains and reducing reliance on

Socionext has renewed its cooperative research agreement with @imec through the Core Partner Program https://t.co/Fe1kKSB6EJ #Semiconductors #Chiplets #3DIC #AdvancedPackaging #SoC