Attended Authenx’s technical forum today — and was delighted to see our SemiVision diagram featured in their presentation! Authenx, founded in 2019 in Taiwan, is an emerging photonic solutions company focusing on silicon photonics, optical components, and laser systems for

TECHPOLYMER™ — Advanced Polymer Microspheres for Next-Gen Materials Sekisui Kasei’s TECHPOLYMER™ represents a new class of polymer particles engineered through advanced suspension polymerization. These hydrophobic vinyl polymers — primarily based on MMA and styrene — offer

The Netherlands — The Next Innovation Hub for Integrated Photonics Just as #ASML elevated the Netherlands to the global forefront of lithography, integrated photonics is now driving a new technological revolution. This time, the focus is on photonic chips, sparking a

Hybrid bonding is quietly becoming one of the most important transitions in advanced packaging — not just for density, but for energy efficiency. Traditional solder and Cu pillar interconnects operate at >100 µm pitch and >80 µm height, while hybrid bonding brings that down to

Nittobo — Japan’s leading glass fabric supplier — is expanding aggressively to meet the surging demand from AI servers, advanced IC substrates, and low-Dk/low-Df materials. Their latest roadmap shows that both Japan and Taiwan plants are ramping up production, with total special

Benefiting from AI-driven demand, high-end CCL adoption favors EMC Among the exhibitors, Taiwanese CCL suppliers such as EMC (Elite Material Co., Ltd.) stand out as one of the few global companies capable of reliably supplying M7 and M8 CCL in sufficient volumes. EMC’s M8 CCL

Unimicron’s Next-Gen High Layer Count PCB Roadmap @ IMPACT 2025 Unimicron showcased its HLC PCB (High Layer Count PCB) roadmap through 2027 — pushing multilayer PCB manufacturing into new territory for AI servers, HPC, and advanced packaging. Presented at: IMPACT 2025 (20th

🟦SemiVision : At TPCA show 2025, SCREEN’s new exposure system — combined with Resonac’s dry film — is now ready for next-generation CoWoP (Chip-on-Wafer-on-PCB) substrate applications. The demo shows that SCREEN’s LUPIOS lithography tool can achieve high-precision mSAP

🌈SemiVision : This slide from Lightmatter’s OCP presentation is excellent — it clearly maps out the 3D CPO (Co-Packaged Optics) assembly and test flow step by step. From PIC and EIC integration to ASIC attach, underfill, and final electro-optic testing, it provides a complete

The industry is entering the CoWoP (Chip-on-Wafer-on-PCB) era — an evolution beyond CoWoS. Unlike traditional CoWoS, which relies on a large and costly FCBGA substrate (with 5–8 ABF layers and ~9/12 µm L/S), CoWoP directly bonds the chip + interposer onto an advanced platform

IMPACT 2025 | ITRI Research Highlights At this year’s IMPACT Conference, ITRI presented a major step forward in low-loss dielectric resin systems for PCB and advanced packaging applications. Key Conclusions •Developed new low-loss dielectric resin systems optimized for

For high-end non-AI server CPU motherboards, ITEQ noted that its M7 halogen-free, ultra-low Df/Dk material IT-988GL, designed for PCIe Gen 6 server platforms, has been qualified by major server ODMs and PCB manufacturers. As switch designs are upgraded from 800G to 1.6T

Intel’s comeback story begins Intel just turned profitable again — reporting a 38% gross margin and returning to growth. CEO Lip-Bu Tan seems to have pulled off a remarkable turnaround — cost cuts, new collaborations with NVIDIA, and a strategic push into AI and ASIC design

EMC: Copper Clad Laminate Process Flow https://t.co/0JuKL85Fd9

Panasonic M9 https://t.co/0JuKL85Fd9

Data Center Giants Face Twin Crises: Power and Heat! At IMPACT 2025 (Oct 21–24, Taipei), industry leaders from TSMC, AWS, Intel, MIRISE Technologies, and Absolics will gather to address one of the most urgent challenges of the AI era — energy efficiency in data centers. Key

At Computex 2025 (Taipei), #Fabric8Labs and #Wiwynn, a leading Taiwanese server manufacturer, jointly showcased ECAM cold plate applications for AI data centers at Taipei Nangang Exhibition Center. The demo combined Fabric8Labs’ advanced thermal structures with Wiwynn’s

🔗 Heterogeneous Integration: The Interconnect Revolution SemiVision: How interconnect innovation defines the future of semiconductor scaling—beyond transistor nodes. From sub-100nm 3D sequential stacking to fan-out and die-level packaging, each layer of integration reflects a

♥️It was a pleasure to participate in the Optical Chip Design & Packaging Technology Forum at WESEMiBAY in Shenzhen (2025/10/15-17). A big thank you to the organizers for the kind invitation. I hope everyone enjoyed SemiVision ’s sharing session! #Semiconductor #Packaging