7 experts discuss hardware security challenges, including new threat models from AI-based attacks. #hardwaresecurity #AIattacks #AI #cybersecurity #semiconductor.

SemiEngineering's latest Manufacturing, Packaging and Materials newsletter. #semiconductor #advancedpackaging #CPO #semiconductormanufacturing

RT @Chip_Insider: Novel Assembly Approaches For 3D Device Stacks:.ECTC progress report on enabling technologies, including cooling chiplets….

Chip Industry Week in Review.EDA export restrictions lifted; collusion risk in the IC supply chain; Onto buys materials analysis biz; assembly-test report; co-packaged optics RFI; 1800 mile EV-range; hybrid bonding. #technology #semiEDA #semiconductor

RT @SemiEngineering: New technical papers recently added to Semiconductor Engineering’s library. #semiconductor #ph….

RT @Chip_Insider: Power Delivery Challenges For AI Chips .Rising power densities and new architectures are forcing a rethinking of intercon….

Novel Assembly Approaches For 3D Device Stacks:.ECTC progress report on enabling technologies, including cooling chiplets, 1µm hybrid bonding, RDL buildups, and co-packaged optics. #semiconductor.

Latest news: DAC’s AI focus; 300mm report; foundry revenue; new auto chips; Micron earnings; rare earth exports plummet; UK’s tech push; power demand explodes; 1M additional IC workers; Berkeley Lab’s EUV litho & more. #semiconductor #technology.

RT @SemiEngineering: New tools and techniques are being developed and can help keep the verification process secure, alongside a firm found….

Evolving lithography demands are challenging mask writing technology, and the shift to curvilinear is happening (Final in 3 part series). #semiconductor #lithography #EUV #photomasks

Latest news: DAC’s AI focus; 300mm report; foundry revenue; new auto chips; Micron earnings; rare earth exports plummet; UK’s tech push; power demand explodes; 1M additional IC workers; Berkeley Lab’s EUV litho & more.#technology #semiconductor #AI.

Disaggregration requires traffic cops and in-chip monitors to function as expected over time. #semiEDA #multidie #chiplets #thermal #heat .#semiconductor.

Thin lines and limited ground planes keep RDL interconnects short. #semiconductor.

New technical papers recently added to Semiconductor Engineering’s library:. #GPUs #semiconductor #edge #analog #AIhardware #EUV #semiconductormanufacturing #photoresists .@ProfMihri

Special Report: EDA’s Top Execs Map Out An AI-Driven Future.AI is accelerating the need for 3D-ICs and digital twins, and causing lots of disruption along the way.

Chip Industry Week in Review.$60B fabs; Chinese automakers tout 100% homemade chips; 2nm custom SRAM; Cadence’s buy; multi-chiplet NoC; HBM roadmap; MIT’s GaN fab technique; 30% tax credit; Taiwan export restrictions, power vulnerability. #technology.

Power Delivery Challenges For AI Chips .Rising power densities and new architectures are forcing a rethinking of interconnects, materials, and thermal management. . #powerdelivery #semiconductor #AIhardware #AI.

Chip Industry Week in Review.$60B fabs; Chinese automakers tout 100% homemade chips; 2nm custom SRAM; Cadence’s buy; multi-chiplet NoC; HBM roadmap; MIT’s GaN fab technique; 30% tax credit; Taiwan export restrictions, power vulnerability. #semiconductor

Are Larger Reticle Sizes On The Horizon? .The stitching process for 1nm litho faces yield challenges with high-NA EUV. #semiconductor #reticle #HighNAEUV #1nm #EUV #lithography #photomasks

HBM Roadmap: Next-Gen High-Bandwidth Memory Architectures (KAIST’s TERALAB):.The 371-page paper provides an overview of next-generation HBM architectures. #HBM #DRAM