📕The Economist Cover Story: “What China Will Dominate Next” — And Why It Raises Bigger Questions About Global Industrial Power The late-November cover of The Economist, titled “What China will dominate next,” paints a vivid picture of China’s expanding technological reach. The

✴️ The MRAM Global Innovation Forum is an annual event that brings together leading experts, researchers, and industry professionals in the field of Magnetoresistive Random Access Memory (MRAM). The forum serves as a platform for sharing the latest advancements, innovations, and

IEDM 2025 – December 6 – 10, 2025 “100 Years of FETs: Shaping the Future of Device Innovations” https://t.co/am8YWe3WGK

Mapping the Frontlines of Photonic-Electronic Integration As next-generation AI and high-performance computing (HPC) systems demand unprecedented bandwidth and energy efficiency, the shift from electrical to optical interconnects is no longer theoretical—it is operational.

Intel’s Solution: Hybrid TIM Structure with Mechanical Isolation To address these issues, Intel proposes using a silicone elastomer matrix to encapsulate liquid metal, forming a "compressible, thermally conductive, flow-restricted" composite TIM. This design preserves the

#NVIDIA CEO Jensen Huang describes AI as a “five-layer cake” — a full technology stack built layer by layer. The five layers include: 1) Energy 2) Chips 3) Infrastructure 4) Model development 5) Applications This framework highlights how AI competitiveness is no longer

Most critically, in the often-overlooked domain of electro-optical co-testing, the trio of TSMC, NVIDIA, and ficonTEC is establishing foundational infrastructure. Among them, ficonTEC plays a pivotal role by delivering the world’s first 300mm double-sided wafer test platform,

At the 2025 IEEE International Electron Devices Meeting (IEDM), imec, world-leading research center in advanced semiconductor technologies, presents the first thermal system-technology co-optimization (STCO) study of 3D HBM-on-GPU , a promising compute architecture for next-gen

🔵SemiVision : Physical AI is not just about algorithms — humanoid robots require an entire ecosystem of high-performance electromechanical actuators. Walking, balancing, grasping, lifting, rotating a joint with human-like precision — all of these depend on advanced motors,

However, pure liquid metal TIMs face several critical challenges: ♦️ Chemical reactivity: Corrosive to copper, aluminum, and silver; prone to IMC formation ♦️Oxidation: Rapid Ga₂O₃ layer formation in air degrades contact quality ♦️Fluidity risks: Potential for contamination

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NEW: POET Redefines Optical Integration with Its Hybrid-Integrated 1.6T 2xFR4 Transmitter PIC "The size, ease of adoption, functionality, value, and performance makes POET’s Hybrid-Integrated 1.6T 2xFR4 transmitter PIC a breakthrough solution for customers. The industry can

A powerful magnitude 7.6 earthquake struck off the coast of Aomori Prefecture, Japan, prompting tsunami warnings across multiple regions.

SK Hynix Adjusts Its 2025 HBM4 Capacity Ramp — A Strategic Shift Aligned With NVIDIA’s Roadmap SK Hynix is revising its mass-production schedule for next-generation HBM4 (6th-gen HBM), pushing back its planned capacity surge from late Q2 2025 to Q3. The move is widely

Jensen Huang: Taiwan’s efforts truly deserve recognition. “We encourage Taiwan to work with us in helping reindustrialize the United States, and they have been tremendously supportive. Taiwan genuinely deserves credit for the enormous effort it has contributed to America’s

This is know how... Not in SOP

💥 Memory Prices Are Surging — And PC Makers Can’t Hold the Line Anymore The DRAM price spike is now spilling into the consumer market. Both Dell and Lenovo have officially begun adjusting product prices, marking the first wave of downstream price hikes. 🔵 Dell • Price hikes

There was no mention of training American technical workers in exchange for tariff reductions, a point that appears to differ from the remarks made by U.S. Commerce Secretary Raimondo. Could this indicate a new negotiation condition? According to Executive Yuan spokesperson Lee

Material Rationale: Silicone-Based Liquid Metal TIM Liquid metal TIMs (e.g., GaIn, GaInSn) offer exceptionally high thermal conductivity (30–50 W/m·K), far superior to typical polymer-based TIMs (3–10 W/m·K). Their liquid nature allows them to fill micro-gaps at the die

✅ 2. Nyingchi Mainling Airport — Exact Location 📍 Coordinates: 29.3030°N, 94.0283°E Very close to the China–India border (Arunachal Pradesh) Lower elevation and milder weather make it suitable for forward operations Imagery shows CH-5 and CH-4 long-endurance drones Some