CEA-Leti and STMicroelectronics reveal a path to fully monolithic silicon RF front-ends using 3D sequential integration. • Their method integrates SiGe HBTs, RF SOI switches, and passives on a single wafer. • Achieves RF isolation and linearity comparable to commercial

3D NAND technology is advancing rapidly, packing more bits into smaller spaces. • Current 3D NAND devices store up to 2 terabits in a fingernail-sized die. • New product cycles have shortened from 18 months to 12 months. • Over 30% of annual capital equipment orders focus on

PowerLattice claims its new chiplets can cut AI data center power use by half. • Chiplets miniaturize high-voltage regulators, reducing power loss by moving closer to processors. • They are less than 1/20th the size of current voltage regulators and only 100 micrometers thick.

AI workloads drive demand for advanced GAA logic and VG DRAM architectures. • GAA logic and VG DRAM promise higher performance and power efficiency. • New OCD metrology tools tackle manufacturing complexity at the nanometer scale. • AI-guided analysis enhances precision and

NTT achieves first RF operation of AlGaN transistors with over 0.75 Al-content. • Demonstrated millimeter-wave signal amplification in AlN-based transistors. • Developed low-resistance Ohmic contact and polarization-doped channel structure. • Achieved RF power amplification

Researchers unveil a chiplet-based approach for scaling trapped-ion quantum processors. • Chiplets are fabricated separately and integrated using heterogeneous techniques. • This modular strategy allows optimal material choice and reduces fabrication limits. • Demonstrated

Qualcomm acquires Ventana Micro Systems to fill a critical gap in its RISC-V strategy. • Ventana brings deep expertise in RISC-V core development. • Qualcomm has significant in-house RISC-V experience and engineering talent. • The acquisition aims to address a specific need

Mitsubishi Chemical Group partners with Boston Materials to advance semiconductor packaging with new thermal materials. • Collaboration focuses on developing the second-gen Liquid Metal ZRT product for HPC and AI data centers. • Boston Materials' first-gen product improved

Cornell University develops new transistor architecture to enhance high-power wireless electronics. • The XHEMT uses a single-crystal AlN substrate, reducing defects by a million-fold compared to traditional GaN devices. • It operates at higher temperatures and voltages,

CHIPX plans to build the first 8-inch GaN-on-SiC wafer fab in Malaysia, marking a regional milestone. • The facility will boost Malaysia's semiconductor production and photonics capabilities. • It aims to support AI data centers with ultra-high-speed connectivity. • The

Navitas expands its global distribution network by partnering with Avnet. • Avnet becomes a globally franchised strategic distribution partner for Navitas. • The partnership aims to support AI data centers, renewable energy, and industrial electrification. • Avnet will provide

AI is transforming semiconductor manufacturing towards "lights-out" operations. • AI enhances circuit design, predictive maintenance, and fab operations. • Connectivity now a primary design focus, crucial for system integrity. • Modular connectivity solutions support expansion

Wise Integration, Powernet, and KEC partner to develop SMPS solutions for AI servers in Korea. • Wise Integration provides GaN power devices and digital-control expertise. • Powernet leads SMPS design using WiseGan and WiseWare technologies. • KEC handles manufacturing,

The US approves exports of Nvidia's H200 AI chips to China, marking a shift in trade priorities. • The H200 chips were previously banned due to security concerns. • This decision reflects a focus on trade over security. • Nvidia's H200 is among its most advanced AI chip

The AI industry's power demands are outpacing supply, leading to a critical energy crisis. • Global data-center electricity consumption could exceed 1,000 terawatt-hours annually by 2030. • AI applications like GPT-5 require vast computational resources, intensifying power

AI is transforming analog and mixed signal chip design by boosting efficiency. • AI aids in requirements analysis, identifying contradictions and gaps in documents. • Neural networks serve as surrogate models, optimizing system design early. • AI automates verification and

The semiconductor industry faces a growing demand for laser-grade gases essential for advanced manufacturing. • Neon, argon, and krypton are critical for excimer lasers in photolithography. • Roughly 70% of global neon supply is used in semiconductor manufacturing. • Rising

Infineon expands its CoolSiC MOSFET 750V G2 lineup with new packages for enhanced efficiency. • New packages include Q-DPAK and D2PAK, offering R DS(on) values up to 60mΩ. • Applications span automotive onboard chargers to industrial EV charging infrastructure. • Features

Lasers are revolutionizing advanced semiconductor packaging with precision solutions. • Heterogeneous integration is key as traditional scaling benefits wane. • Low-κ materials improve performance but pose manufacturing challenges. • Ultrashort pulse lasers offer damage-free

AI inference is shifting from the cloud to the edge for better efficiency and privacy. • Edge devices use NPUs designed for efficiency under power and memory constraints. • Expedera's packet-based NPU architecture boosts utilization to 60-80% without network changes. •