【刊行物】10月20日に、Gichoビジネスコミュニケーションズ㈱が『エレクトロニクス実装技術』誌11月号を発行。今月号の特集は『実装工程の効率化』。現場でのクリーン化技術、基板へのレーザマーキング。詳細は https://t.co/DxMHKiQNMR に。 #Gicho #Magazine #ElectronicsPackaging

【刊行物】11月20日に、Gichoビジネスコミュニケーションズ㈱が『エレクトロニクス実装技術』誌12月号を発行。今月号の特集は『半導体技術の動向を探る』。樹脂接合強度、ウェット工程、サステナブル半導体実装。詳細は https://t.co/b5bR2z7rhO に。 #Gicho #Magazine #ElectronicsPackaging

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【刊行物】4月20日に、Gichoビジネスコミュニケーションズ㈱が『エレクトロニクス実装技術』誌5月号を発行。特集は『環境関連技術』。環境規制、半導体洗浄。詳細は https://t.co/DxMHKiQNMR に。 #Gicho #Magazine #ElectronicsPackaging

𝗧𝗵𝗲 𝗣𝗼𝘄𝗲𝗿 𝗼𝗳 𝗛𝗲𝗮𝗱𝗽𝗵𝗼𝗻𝗲 𝗣𝗮𝗰𝗸𝗮𝗴𝗶𝗻𝗴: 𝗠𝗼𝗿𝗲 𝗧𝗵𝗮𝗻 𝗝𝘂𝘀𝘁 𝗮 𝗕𝗼𝘅! https://t.co/BVPmNjhnPU https://t.co/zfzjow5ixp #PackagingDesign #ProductPackaging #GraphicDesign #BrandIdentity #CreativeDesign #TechPackaging #ElectronicsPackaging

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【刊行物】2月20日に、Gichoビジネスコミュニケーションズ㈱が『エレクトロニクス実装技術』誌3月号を発行。特集は『プリント配線板技術』。パッケージ基板の進化、超微弱電流用フレキシブル基板。詳細は https://t.co/DxMHKiQNMR に。 #Gicho #Magazine #ElectronicsPackaging