Wire bonding in action. ~20 µm gold wire forming ball & stitch bonds between die pads and package leads. Millisecond cycle time. Thousands of interconnects per chip. Micron-level placement accuracy required. #wirebonding #PCB #KnownPCB

BGA Via-in-Pad Tips 🛠️ Fine-pitch BGA needs space! But avoid solder wicking: ✅ Fill & Cap: Use IPC-4761 Type VII for a flat, solderable pad. ✅ SI: Filled vias eliminate stubs for high-speed/RF . ✅ Thermal: Copper-fill is best for heat/current. #PCBDesign #BGA #DFM #KnownPCB

Same BGA. Different solder joint integrity. NSMD vs SMD isn’t a cosmetic choice. It changes solder wetting, stand-off height, and where thermal stress concentrates. That’s why fine-pitch BGA reliability often starts with pad definition — not assembly. #BGA #NSMD #PCBDesign #DFM

🐎 Happy Chinese New Year 2026! Wishing our global partners success, growth and strong cooperation in the Year of the Horse. #ChineseNewYear #PCB #YearOfTheHorse #PCBManufacturer

Is a half-plated hole a PCB defect?No！！ In wireless and IoT modules, they’re often what makes mass production scalable and repeatable. Not cheaper. Not easier. Just more reliable. #PCBManufacturing #KnownPCB #CastellatedHoles #PCBDesign

Small soldering defects can quietly destroy PCB reliability. Solder balling, tombstoning, bridging, icicles, Head-in-Pillow, coplanarity issues, component shift… Most failures don’t start big — they start small. Which one have you dealt with most? #PCBA #SMT

More layers ≠ better FPC. The wrong layer count can increase cost, reduce flexibility, and complicate your design. Smart FPC design is about balance — not complexity. #FPC #FlexiblePCB #PCBDesign #RigidFlex #PCBLayers #PCBManufacturing #KnownPCB

PCB “classic rules” that still matter for high-speed & EMI 👇 🔹 3W Rule Spacing ≥ 3× trace width → cut crosstalk by ~90% 🔹 20H Rule Power plane setback ≥ 20× dielectric height → reduce edge radiation & EMI #PCBDesign #Knownpcb #PCBLayoutTips #HardwareDesign #PCBLayout

Tin whiskers: a microscopic PCB reliability risk. These metal filaments can grow between pads and cause short circuits. They’re often invisible during inspection. A small phenomenon with big consequences. #PCB #TinWhisker #PCBFailure #KnownPCB

A silicon wafer contains hundreds of identical integrated circuits. In this step, a focused laser is used to separate the wafer into individual dies by cutting along the streets between chips. This process requires micron-level alignment to avoid damaging active circuits.

Most BGA defects don’t start in reflow. They’re the result of small variations in paste printing, placement, and pre-reflow conditions stacking up. BGA reliability is a system outcome — not a single-step issue. #SMT #PCB #BGA #ElectronicsManufacturing #KnownPCB

Looks fine… But it’s not. Head-in-Pillow (HiP) is a BGA defect where contact ≠ connection. Oxidation, paste collapse mismatch, or PCB/package warpage can all cause this false joint. System-level process control is key. #BGA #PCB #ElectronicsManufacturing #HiP #ProcessControl

Voids in BGA joints are invisible — but they weaken the joint from the inside. They form from combined SMT process factors, not a single mistake. BGA reliability is built before the board even leaves reflow. #PCB #BGA #SMT #ElectronicsManufacturing #KnownPCB

It is about my company. Shenzhen KnownPCB technology Co.,Ltd.

Join knownpcb at #GlobalSourcesConsumerElectronicsShow 2023 from Mar.11 to - 14 in HongKong! Don’t miss our 11Q14 #AsiaWorld-Expo. We’re waiting for you with our #PCB and #PCBA product

Ever had a circuit board fail even though every solder joint looked perfect? That’s probably a poor solder joint — a connection that seems fine but never truly bonds. #PCB #PCBADefects #PoorSolderJoint #knownpcb #PCBManufacturing #SolderingTips #ManufacturingQuality

Sometimes, solder doesn’t just connect,it builds a bridge. A tiny solder tin connection can short your board,burn a chip,or kill a whole product. Check your stencil, your paste, and your temperature curve. #SolderTinConnection #PCBA #TechFailure #SMT #PCBManufacturing #knownpcb

Those “shark-tooth” shapes on your PCB aren’t cutting marks. They’re Spark Gaps — tiny features that guide static away from sensitive components. #SparkGap #PCBDesign #PCBEngineering #knownpcb #PCBProtection #PCBManufacturing #PrintedCircuitBoard #PCBIndustry

Resin via plugging is not just a process. It solves real issues: voids, blow holes, copper residue, unreliable vias. We don’t just manufacture PCBs ,we help you solve design and reliability problems. #PCBManufacturing #PCB #ResinViaPlug #PCBProduction #knownpcb #PCBFactory