COIN-3D Project
@coin3d_project
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#EU-funded project that aims to foster strategic networking and knowledge exchange to enhance research capacities in the area of 2.5/3D #chiplet architectures.
Volos, Greece
Joined September 2024
🚨 Just 5 days to go!.Join us at HiPER-3D — the 1st Workshop on High Performance and Energy Efficient Architectures for 3D Chiplets, co-located with #ICDCS2025 in Glasgow 🇬🇧 on 20 July!. 🔗 #HiPER_3D #3DChiplets #COIN3D_EU #HorizonEurope #AIforEDA.
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🙏 Thank you to everyone who joined us at the Open Innovation Seminar!.⭐ A special thank you to our incredible speakers, your contributions sparked great dialogue and new ideas. We’re excited to keep the conversation going!.#COIN3D_EU #OpenInnovation #Seminar #InnovationInAction
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🚨 The time is here! .The seminar kicks tomorrow in Volos!.🌟 Only a few seats left — grab your free ticket now: 📄 Check the agenda & access the online links here:
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🔓Join the #OpenInnovation Seminar on June 25-27!.Dive into demand-driven R&I and how collaboration fuels real-world impact. 🎯Perfect for researchers, innovators & entrepreneurs. 🎟️#COIN3D_EU #Innovation #Seminar #TechTransfer #Collaboration
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🚀 The 2nd COIN-3D Newsletter is out!.Catch up on project highlights, research updates, and recent events — including our Advanced Course, second webinar, and latest publications on 3D chiplet reliability. 📖 Read the full newsletter here:
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5⃣ Only 5 days left!.🎟️ Limited tickets remaining – grab yours while you can!.📒 Check out the full agenda on our website:
coin3d-project.eu
Advanced Courses About Advanced Courses Advanced Courses will feature a series of lectures and workshops designed to keep scientists informed about the latest developments in the field. These...
🚨 New hybrid course by COIN-3D!. Foundations of EDA Tools in 2.5/3D Chiplet Reliability.🗓️ 28 Apr – 2 May, Univ. of Thessaly, Volos 🇬🇷.🧠 Lectures, workshops & events on chiplet reliability!.🔗 Register: 🔜 Online link coming soon!
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🚨 New hybrid course by COIN-3D!. Foundations of EDA Tools in 2.5/3D Chiplet Reliability.🗓️ 28 Apr – 2 May, Univ. of Thessaly, Volos 🇬🇷.🧠 Lectures, workshops & events on chiplet reliability!.🔗 Register: 🔜 Online link coming soon!
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🌟 Thanks for joining our 2nd #COIN3D_EU webinar:. "Custom Tool Development Strategies for Chiplet Reliability"!.👏 Huge thanks to our speakers & everyone who tuned in!.🎥 Full: 📺 Playlist: #HorizonEurope #3DVLSI #EDA.
www.youtube.com
📢 COIN-3D Webinar Series: "Custom Tool Development Strategies for Chiplet Reliability" 🌟 Explore the latest strategies in custom tool development for chiplet...
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🔹 Meet our final COIN-3D partner: UvA! 🔹. UvA’s PCS group advances parallel & distributed computing, contributing to 3D IC reliability with the CoMeT Simulator. #COIN3D_EU #UvA #3DVLSI #EDA #Chiplets #Reliability #HPC.
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🔹 Meet our next COIN-3D partner: UGLA! 🔹. UGLA’s KDES group specializes in Distributed Computing, AI & Machine Learning, contributing to EDA for 2.5D/3D chiplets. #COIN3D_EU #UGLA #3DVLSI #EDA #Chiplets #AI #MachineLearning.
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🔹Meet our next COIN-3D partner: UBREMEN!🔹.UBREMEN specializes in microelectronics & embedded systems, focusing on low-power design, 3D integration, and hardware accelerators to enhance system efficiency. #COIN3D_EU #UBREMEN #3DVLSI #EDA #Chiplets #LowPower #HardwareAcceleration.
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🔹 Meet the first partner of COIN-3D: University of Thessaly (UTH)! 🔹. UTH drives research in 2.5D/3D VLSI, reliability, and ML, offering hands-on experience to students & researchers. #COIN3D_EU #UTH #3DVLSI #EDA #Chiplets.
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🚀 COIN-3D: Collaborative Innovation in 3D VLSI Reliability! 🚀.A Horizon Europe project boosting UTH’s research capacity. Stay tuned this week, as we introduce our amazing partners!.#COIN3D_EU #3DVLSI #Reliability #EDA #Chiplets #Semiconductors.
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🔬 Research Visit: As part of COIN-3D, Dr. Olympia Axelou collaborated on Power Grid Optimization with ML, engaging with Prof. Chris Anagnostopoulos & Dr. Tahani Aladwani to explore future research directions. #COIN3D_EU #HorizonEurope #3DVLSI #Innovation #Semiconductors
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📢Join us for the second webinar of COIN3D! .🌟 Webinar Topic: Custom Tool Development Strategies for Chiplet Reliability.📅 Date: 28th March 2025.🕒 Time: 12:00 – 13:15 CET.📍 Location: Online.🎟️ Register here:
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📢Join us for the second webinar of COIN3D! .🌟 Webinar Topic: Custom Tool Development Strategies for Chiplet Reliability.📅 Date: 28th March 2025.🕒 Time: 12:00 – 13:15 CET.📍 Location: Online.🎟️ Register here:
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RT @ICDCS2025: #ICDCS2025's HiPER-3D Workshop from @coin3d_project explores high-performance, energy-efficient 3D Chiplet architectures for….
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🌟 Thanks for joining our first COIN-3D webinar!. 🎥 Full webinar: 📺 Sessions playlist: Stay tuned for more! 🚀.#COIN3D_EU #HorizonEurope #3DVLSI #Innovation #Collaboration #Semiconductors.
www.youtube.com
📢 COIN-3D Webinar Series: "Machine Learning Applications in EDA for Chiplet Reliability" 🌟 Dive into the world of AI and Machine Learning in Electronic Desig...
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We’re excited to announce the HiPER-3D Workshop at ICDCS 2025! 🚀.📅 Date: 20 July 2025.📍 Location: Glasgow, Scotland.🔍 For more details and information on the topics related, visit: 📌 Dates: .Submission: 15 March 2025.Notification: 2 April 2025
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🎟️ Only 1 week to go!. Limited tickets remaining—EDA researchers, engineers, tech enthusiasts, and curious minds are already on board!. This is an event you won’t want to miss!. Register here: #COIN3D_EU #HorizonEurope #3DVLSI #Innovation #Collaboration.
www.eventbrite.co.uk
Learn how AI is revolutionizing chip design and shaping the future of semiconductors in this online event!
📢Join us for the first webinar of COIN3D!. 🌟 Webinar Topic: Machine Learning Applications in EDA for Chiplet Reliability.📅 Date: 31st January 2025.🕒 Time: 12:00 – 13:10 CET.📍 Location: Online.🎟️ Register here:
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