MacDermid Alpha Electronics Solutions
@MacDermidAlpha
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MacDermid Alpha brings together the world’s best innovation and technical service to the electronics and surface finishing industries.
Joined November 2010
Visit Booth M18 to connect with our team and explore practical strategies for your manufacturing challenges. See you there! #FIEEBrazil #ElectronicsManufacturing #ThermalManagement #ElectronicsCooling #SolderSolutions #SustainableElectronics
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Join us at FIEE, September 9–12, Booth M18, São Paulo Expo, for insights on thermal management, advanced solder solutions, and assembly processes that enhance reliability and support sustainable, reworkable assemblies.
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- Higher Performance - Greater Reliability - Improved Sustainability. These are the priorities shaping electronics manufacturing today.
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Thank you for visiting us at #KPCA2025 in Incheon! We enjoyed sharing how Shadow® Plus, Systek™ IC Substrate, and Affinity™ ENIG/ENEPIG are tackling challenges in high-density PCB & IC substrate technologies. Keep connected with us here: https://t.co/5YHVczGEPe
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Don’t miss this opportunity to connect with our team to discuss our portfolio of chemistries enabling the next generation of high-density PCB and IC substrate designs. Click here for more information on the event: https://t.co/JoE6k04aDm
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Visit us at booth # B309 to explore how we are driving innovation in high-reliability circuit board fabrication, delivering cutting-edge direct metallization, advanced plating, and interconnect solutions for a wide range of markets, including high-performance computing and (AI).
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Update from the KPCA Show 2025 – and the conversation is all about solving complex interconnect challenges.
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Visit booth # L1108 to explore how our innovations are redefining reliability in next-generation 3D packaging. Learn more: https://t.co/EP3GFl5mrA
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- Fine grain copper for hybrid bonding – Exhibits exceptional thermal stability, void-free performance, and enhanced electromigration reliability - ReCo barrier material – Intermetallic-compound (IMC) free micro-pillar solder joints for superior long-term reliability
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They’ll unveil two breakthrough materials designed to overcome thermal and structural barriers in advanced packaging...
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"Material Innovations for Reliable 3D Interconnects: Fine-Grain Cu for Hybrid Bonding and IMC-Free Barriers for Micro-Pillar Solder Joints" - September 11, 2:00 PM TST – 2:20 PM TST - Room # 404
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With shrinking nodes and vertical integration on the rise, 3D packaging is becoming the new standard, but it comes with complex reliability challenges. Join Tao-Chi Liu, Ph.D, Senior R&D Manager and Wenbo Shao, Ph.D., Senior R&D Manager at Semicon Taiwan for this presentation...
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As high-performance #computing (#HPC) and artificial intelligence (#AI) accelerate, the demand for faster, more reliable memory technologies is pushing traditional packaging to its limits.
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Connect with our experts from September 17–19 in Hall 4, booth H4C81 so you can learn how our advanced materials can help you meet your thermal, mechanical, and sustainability goals. Visit here to learn more: https://t.co/LnDU0I2qgs
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We’re bringing our latest innovations in electronics materials to Productronica India 2025, showcasing integrated solutions that enhance performance, protection, and reliability across: - Circuit Board Assembly - Semiconductor Assembly - Wafer-Level Packaging
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If you missed the opportunity to discuss how our advanced solutions can benefit you, or if you have additional questions, connect with our experts here:
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We highlighted our advanced solutions for complex PCB designs including: - Shadow® Plus advanced direct metallization technology - Affinity™ ENIG/ENEPIG surface finishes - MacuSpec™ VF-TH 500 simultaneous via filling and through hole plating acid copper metallization process
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Thank you for stopping by our booth at the Thailand Electronics Circuit Asia (THECA) Show last week in Bangkok!
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Catch this complimentary webinar featuring Avin Dhoble, Global Product Manager, and get practical insights to inform your next material decision. Watch it here:
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Engineers and procurement professionals, this one’s for you. Learn how the ATROX™ product line can help your team achieve: - Improved thermal conductivity - Long-term reliability - Zero PFAS compliance - Production-ready performance
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