Kurnal
@Kurnalsalts
Followers
4K
Following
11
Media
154
Statuses
409
Maybe Kurnal 也许是Kurnal，也许不是Kurnal 中文/EN(?) Kurnal’s English is Terrible，Use Translator Talking Team in Telegram：https://t.co/eC3QerrDez
Joined March 2022
Common Automotive Chips. Samsung：.Exynos Auto V7/V9.Exynos Auto V720/V920. Qualcomm:.SA8195P.SA8295P.SA8650P. Huawei:.Kirin 9610A. Siengine:.SE1000
2
15
183
Kirin X90&Kirin 9610A Dieshot. diesize 12.82x 16.34.technology：SMIC N+2
7
48
360
Huawei Ascend 910C chip analyze. TSMC N7 Family. Same chip with 910B. Video on Youtube：.
7
35
271
AMD Threadripper 9995WX IOD Dieshot. Thanks By@ASUS Tony 俞元麟 give chip .Thanks By@万扯淡 Decap.@Kurnalsalts Layout. P1： IOD Diesize：16.45mm x 25.94mm.P2：CPU Diesize：7.76mm x 9.05mm
10
64
449
Hexgon Package decaped 2/2. P1:die1 shot.P2:die1 diemark.P3:die2 shot.P4:die2 diemark
1
3
48
working. New Video：.Huawei Car Chip（990A&9610A) analyze.Huawei Ascend 910C analyze
5
15
148
intel3 VS intel 18A .HD increase 31.25%，HP increase 33.32%. intel18A HD contrast TSMC N3E&P HD.18A HD was similar with TSMC N3E HD(2-2).decrease than TSMC N3E Finflex HD(2-1) 14.2%. intel18A HP contrast TSMC N3E&P HP.18A HP have the more density than N3E HP&N3E Finflex HP
7
17
147
lol
2025 VLSI intel 18A analysis (b).1)Compute Die 114.34mm2 reference other Logic Chip Layout .2)Logic Circuit Area around 46% ~ 52.6 mm2 then scaling 72% .3)SRAM Area around 29% ~ 33.15 mm2 then scaling 12% .4)Total Chip Density scaling approximately 36% ~ 194.98 MTr/mm2
2
13
94
The First SoC by Xiaomi. Xring O1 Dieshot .Thanks By Geekerwans and 万扯淡 .Layout By Kurnal.Diesize=10.8x10.6=114.48mm2.Used area=109.5xmm2
23
172
1K
Analysis of Xiaomi XRing self-developed watch chip analysis report.Video：.
2
15
162
The world's first Nintendo Switch 2 .Chip and process analysis report. Video：.
2
10
62
The world's first Nintendo Switch 2 Dieshot .Samsung 8N .8Core A78C,Share 4M L2 .1536Cuda/6TPC ampere GPU . A detailed process and chip analysis report will be released on Youtube and Bili at 9:30 pm tomorrow. High-resolution photos in Telegram group:.
61
364
2K
RT @SemiAnalysis_: Excited to announce our new SemiAnalysis Die Yield Calculator, a tool we made public to help others understand semi yiel….
0
45
0
The Semiconductor process.with 16nm to 18A Logic Density/mm2 .By TSMC/Samsung/Intel/GlobalFound/SMIC
8
15
126
The intel Semiconductor process Total 22nm to 18A Logic density
2
11
74
The graph of the 16nm to 3nm（TSMC/SEC/GF/SMIC) Logic density data
0
5
46