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Kurnal

@Kurnalsalts

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159
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424

Maybe Kurnal 也许是Kurnal,也许不是Kurnal 中文/EN(?) Kurnal’s English is Terrible,Use Translator Talking Team in Telegram:https://t.co/eC3QerrDez

Joined March 2022
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@Kurnalsalts
Kurnal
28 days
MediaTek Dimensity 9500 Dieshot Diesize 10.88x12.92=140.79mm2 Photo#1 D9500 Dieshot Photo#2 8Elite Gen5 VS D9500 Photo#3 D9500 VS D9400 VS D9300
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@Kurnalsalts
Kurnal
1 month
Qualcomm SM8850(8Elite Gen5) Dieshot Diesize 10.57mm x11.94 mm
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@Kurnalsalts
Kurnal
1 month
Qualcomm SM8850 8Elite Gen5 Doing....
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@Kurnalsalts
Kurnal
2 months
Raipidus share the data with 2nm(Named 2HP) so that,we can know the NEXT Gen process technology in Logic Density
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@Kurnalsalts
Kurnal
2 months
Huawei New server chip KunPeng 930 Tech: CPU Die :TSMC N5 Family IO Die : SMIC 14? Analyze chip Video in Bili and Youtube https://t.co/948uriMwgo
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@Kurnalsalts
Kurnal
3 months
Common Automotive Chips Samsung: Exynos Auto V7/V9 Exynos Auto V720/V920 Qualcomm: SA8195P SA8295P SA8650P Huawei: Kirin 9610A Siengine: SE1000
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@Kurnalsalts
Kurnal
3 months
Kirin X90&Kirin 9610A Dieshot diesize 12.82x 16.34 technology:SMIC N+2
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@Kurnalsalts
Kurnal
3 months
Huawei Ascend 910C chip analyze TSMC N7 Family Same chip with 910B Video on Youtube: https://t.co/rHsBVDPEzS
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@Kurnalsalts
Kurnal
3 months
AMD Threadripper 9995WX IOD Dieshot Thanks By@ASUS Tony 俞元麟 give chip Thanks By@万扯淡 Decap @Kurnalsalts Layout P1: IOD Diesize:16.45mm x 25.94mm P2:CPU Diesize:7.76mm x 9.05mm
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@Kurnalsalts
Kurnal
3 months
Hexgon Package decaped 2/2 P1:die1 shot P2:die1 diemark P3:die2 shot P4:die2 diemark
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@Kurnalsalts
Kurnal
3 months
Hexgon Package decaped
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@Kurnalsalts
Kurnal
3 months
working.... New Video: Huawei Car Chip(990A&9610A) analyze Huawei Ascend 910C analyze
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@Kurnalsalts
Kurnal
5 months
intel3 VS intel 18A HD increase 31.25%,HP increase 33.32% intel18A HD contrast TSMC N3E&P HD 18A HD was similar with TSMC N3E HD(2-2) decrease than TSMC N3E Finflex HD(2-1) 14.2% intel18A HP contrast TSMC N3E&P HP 18A HP have the more density than N3E HP&N3E Finflex HP
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@Kurnalsalts
Kurnal
5 months
lol
@meng59739449
meng
5 months
2025 VLSI intel 18A analysis (b) 1)Compute Die 114.34mm2 reference other Logic Chip Layout 2)Logic Circuit Area around 46% ~ 52.6 mm2 then scaling 72% 3)SRAM Area around 29% ~ 33.15 mm2 then scaling 12% 4)Total Chip Density scaling approximately 36% ~ 194.98 MTr/mm2
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@Kurnalsalts
Kurnal
5 months
The First SoC by Xiaomi Xring O1 Dieshot Thanks By Geekerwans and 万扯淡 Layout By Kurnal Diesize=10.8x10.6=114.48mm2 Used area=109.5xmm2
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@Kurnalsalts
Kurnal
6 months
Analysis of Xiaomi XRing self-developed watch chip analysis report Video: https://t.co/oyrIlNX1od https://t.co/wCTnuSVbC7
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@Kurnalsalts
Kurnal
6 months
The first SoC chip by Xiaomi Xring!
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@Kurnalsalts
Kurnal
6 months
The SWitch2 T239 Analysis Report PDF on Telegam Team: https://t.co/MI6oCa20Z2
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@Kurnalsalts
Kurnal
6 months
The world's first Nintendo Switch 2 Chip and process analysis report Video: https://t.co/U2pKSSoBuD
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@Kurnalsalts
Kurnal
6 months
The world's first Nintendo Switch 2 Dieshot Samsung 8N 8Core A78C,Share 4M L2 1536Cuda/6TPC ampere GPU A detailed process and chip analysis report will be released on Youtube and Bili at 9:30 pm tomorrow. High-resolution photos in Telegram group: https://t.co/MI6oCa2yOA
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