Electronica Azi
@ElectronicaAzi
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Electronica Azi: news and technical articles for the design engineers within research, development and technical management in the electronics field.
Romania
Joined March 2018
Silanna Semiconductor has signed a distribution agreement with DigiKey to make its Plural 10- to 16-bit ADCs widely available. These factory-configurable data converters offer high performance, faster lead times and lower pricing compared to traditional ADC brands. | More info
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Infineon launches the PSOC 4 HVPA-SPM 1.0, an advanced MCU designed for high-voltage battery management systems in xEVs, integrating high-precision current, voltage and temperature sensing, supporting zonal architectures, and meeting ASIL-D safety standards. | More info at:
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The Portwell NANO-6065 Nano-ITX embedded board addresses intelligent edge deployments with compact efficiency. Built for digital signage, smart retail and automation, it supports Intel Core/N-series or Atom x7000RE processors, up to DDR5-4800 memory, dual Intel Ethernet,
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iDEAL Semiconductor sets a new safety benchmark for high-voltage battery systems with its SuperQ™ MOSFETs, offering higher short-circuit-withstand capability and ultra-low RDS(on) suitable for packs from ~72 V and up. | More info at: https://t.co/ArYoH94h4V
#powersemiconductors
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Same Sky launches new speaker enclosure design services, offering tailored mechanical design, custom finishes and global supply options to support audio component integration. | More info at: https://t.co/Mxtn0wfei2
#audioengineering #speakers #mechanicaldesign
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SAICEC and Siemens are collaborating to accelerate chip-to-vehicle validation using digital twin technology. They’re using Siemens’ PAVE360 platform to build detailed virtual models of automotive architectures, enabling early system-to-chip verification and helping OEMs reduce
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Synaptics launches the SL1680 embedded IoT processor – a high-efficiency SoC featuring a quad-core Arm Cortex-A73 CPU, multi-TOPS NPU, GPU for advanced graphics and AI acceleration, and full multimedia capability for consumer and industrial IoT applications. | More info at:
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Silicon Labs’ new SixG301 ultra-low-power wireless SoCs, now available at Mouser, feature an ARM Cortex-M33 core up to 150 MHz, up to 4 MB flash, 512 KB RAM, a high-performance 2.4 GHz radio and Secure Vault High security, targeting smart lighting and IoT devices. | More info at:
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Microchip Technology introduces its LAN866x 10BASE-T1S endpoint devices, designed for zonal in-vehicle Ethernet architectures. These software-less endpoints serve as bridges that translate Ethernet packets to local digital interfaces, supporting a 10BASE-T1S multidrop topology to
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SemiQ Inc. has expanded its 1200 V Gen3 SiC MOSFET line with five SOT-227 packaged modules offering RDSon values of 7.4 mΩ, 14.5 mΩ and 34 mΩ – targeting battery chargers, PV inverters, energy-storage and server power supplies. | More info at: https://t.co/89ogNgkodn
#SiC
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Sfera Labs has announced new, lower pricing for its industrial I/O modules IONO RP and IONO RP D16, making them more accessible for automation, IoT and IIoT projects. | More info at: https://t.co/R0Azzl7mpY
#industrialautomation #IOModules #IoT #IIoT
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Vishay’s new VEMD8083 silicon PIN photodiode features a compact 3.2 × 2.0 × 0.6 mm surface-mount package, a 2.8 mm² sensitive area, visible to near-infrared range (350-1100 nm), fast response (30 ns rise/fall), and is ideal for biomedical sensing applications. | More info at:
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Toshiba expands its low-voltage single-gate logic device lineup with 21 new XSON6-packaged ICs in the “7UL” series (12 in 7UL1G for down-translation, 9 in 7UL1T for up-translation). The full series now comprises 85 products. | More info at: https://t.co/U76eMkzVRz
#logicICs
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Toshiba has introduced the TB9084FTG, a cost-effective gate-driver IC for three-phase BLDC motors in automotive systems. It supports 5.7 V to 28 V operation, is AEC-Q100 Grade 0 qualified (-40°C to +150°C) and comes in a compact 6 × 6 mm package. | More info at:
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A new 12-slot LXI/USB chassis from Pickering Interfaces supports up to 12 hybrid PXI/PXIe modules in a 2 U rack-height chassis, offers USB 3.0 or Gigabit Ethernet control (eliminating the need for a dedicated PXI controller), and delivers highest slot density + lowest
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Melexis introduces the MLX90382 magnetic encoder for automotive e-chassis systems, offering precise rotor position sensing, high immunity to rail transients and compact package suitable for harsh environments. | More info at: https://t.co/89PBdDdHgx
#automotiveelectronics
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Melexis has introduced the MLX90637, the first automotive-grade surface-mount infrared temperature sensor, offering non-contact measurement, 0.02°C resolution and an ambient range from -40°C to +125°C for EV powertrain applications. | More info at: https://t.co/kZfsfyKnQJ
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Melexis has launched the MLX81350, a three-core automotive LIN motor driver designed for EV air-conditioning flaps and electronic air-vents. The device supports up to 0.5 A per motor, builds on high-voltage SOI tech, includes sensorless closed-loop field-oriented control (FOC)
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Expanded ultra-high-density Series 125 relays introduce new Form A, Form B, Form C and coaxial versions, preserving a compact 5 mm × 5 mm pitch and maximising channel density for ATE switching matrices. | More info at: https://t.co/OS1QZZEPLp
#ATE #reedrelays #highdensity
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Renesas Electronics’ new RZ/G3E Arm® Cortex-A55-based MPU is now available at Mouser. The MPU features a quad-core Cortex-A55 CPU, a Cortex-M33 core and an Ethos™-U55 NPU for AI tasks, aimed at HMI (Human-Machine Interface) applications with high-performance graphics, video
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